名称:纳米镍粉
粒径:99.9% 形貌:球形
磁流体
用铁、钴、镍及其合金粉末生产的磁流体性能优异,可广泛应用于密封减震、器械、声音调节、光显示等领域。
高效催化剂
由于比表面巨大和高活性,纳米镍粉具有极强的催化效果,可用于有机物氢化反应、汽车尾气处理等。
高效助燃剂
将纳米镍粉添加到火箭的固体燃料推进剂中可大幅度提高燃料的燃烧速度、燃烧热,改善燃烧的稳定性。
导电浆料
电子浆料广泛应用于微电子工业中的布线、封装、连接等,对微电子器件的小型化起着重要作用。用镍、铜、铝、银纳米粉体制成的电子浆料性能优越,有利于线路进一步微细化。
高性能电极材料
用纳米镍粉辅加适当工艺,能制造出具有巨大表面积的电极,可大幅度提高放电效率。
活化烧结添加剂
纳米粉末由于表面积和表面原子所占比例都很大,所以具有高的能量状态,在较低温度下便有强的烧结能力,是一种有效的烧结添加剂,可大幅度降低粉末冶金产品和高温陶瓷产品的烧结温度。
金属和非金属的表面导电涂层处理
由于纳米铝、铜、镍有高活化表面,在无氧条件下可以在低于粉体熔点的温度实施涂层。此技术可应用于微电子器件的生产。
1. Magnetic Fluid
Application of Nano nickel and its alloy in production of magnetic
fluid can be widely used for sealed shock absorption, medical
equipment, sound insulation, light display and other application area.
2. Efficient Catalysts
Due to large and highly active surface area, nano-nickel powder
has a strong catalytic function. It can be used for hydrogenation
of organic compounds and vehicle exhaust gas processing.
3. Efficient Combustion Agent
Nano nickel powder can be used as the additive of rocket solid fuel
propellantto greatly improve fuel burning rate and burning heat so
as to increase
combustion stability.
4. Conductivity Paste
Nano nickel powder is widely used in microelectronics industry for
manufacturing of microelectronic devices. Like copper, aluminum and
silver, nickel nano powders can be used for mixing electricity
conductive paste to improve the conductivity of circuit boards.
5. High-performance Electrode Materials
Nano Nickel fluid with appropriate technology can produce tremendous
surface area of the electrodes that can significantly improve the
discharge efficiency.
6. Activated Sintering Additives
Due to the large proportion of surface area and surface atoms, nano
nickel powder has a high energy state at a lower temperature sintering
which has a strong ability as an effective sintering additive.
7. Metal and Non-metallic Conductive Surface Coating
Like the nano aluminum and copper, nickel has a high active surface.
Under the anaerobic conditions, it can lower the melting temperature
by the implementation of surface coating. This technique can be
applied to the production of microelectronic